Applied Materials Inc, Santa Clara semiconductor capital equipment maker has filed a shelf registration with the US Securities & Exchange Commission to offer common stock and debt securities to raise as much as $600m. Once the registration statement becomes effective, it currently intends to offer 3.5m new shares of common, and then, over time, to offer up to $300m of medium term notes or other debt securities. Insatiable demand for chips is putting pressure on fabrication equipment makers.
BellSouth Corp’s BellSouth Telecommunications Inc has filed a shelf registration with the US Securities & Exchange Commission covering up to $575m in debt securities, and combined with previous registrations, it gives the company $1,000m to draw down as and when needed. It wants the cushion for refinancing its debt and for any working capital needs.
Mattson Technology Inc, Fremont, California builder of chip fabrication equipment, sold 1.1m shares, 785,000 of them new in a public offering, and wants the indicated net proceeds of $13.5m or so for working capital. Hambrecht & Quist LLC was lead manager, supported by PaineWebber Inc and Needham & Co Inc serving as the co-managers for the issue.
