Seven partners from the German business and research communities have collaborated in the three-year "RELY" project to develop new ways of chip design methodology.
The research project will explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems, and will focus on applications in transportation, in particular electromobility, in medical technology and automation.
The German Federal Ministry of Education and Research (BMBF) is providing EUR7.4m for the project under the "Information and Communications Technology 2020" program.
The project aims at designing new development processes for advanced microelectronic systems and integrating new reliability and safety criteria.
Infineon Technologies, EADS Deutschland, the Fraunhofer-Gesellschaft, MunEDA GmbH, X-FAB Semiconductor Foundries, the Technical University of Munich and the University of Bremen are the seven partners in the research project.
The project partners will carry out research work to develop novel chip architectures that will allow a chip to automatically determine its operating status, react to it and enter into interaction with the electronic system, providing timely alerts in case of a wear.
The scope of the project includes formulating new chip design specifications, extending the modeling of manufacturing technologies, defining new characteristics in higher design levels, and enabling system simulation and chip verification with respect to reliability.
