Ralink Technology and TrendChip Technologies, a supplier of broadband connectivity chipsets, have signed a merger agreement to expand in the home networking and broadband access semiconductor markets.
The new company formed through the merger will be called Ralink Technology Corp, and each 0.8209 share of TrendChip will be exchanged for one share of Ralink. Management of the combined 600 person company will include executives and board members from both organisations.
Founded in 2001, TrendChip is headquartered in Hsinchu, Taiwan, and maintains development centres in Suzhou and Nanjing China. TrendChip is a xDSL CPE semiconductor supplier in the market with over 90% growth in 2009.
To streamline integration of the two companies, and to maximise operational efficiencies during the transition period, Ralink has appointed Shinjou Fang, chairman of TrendChip Technologies to be CEO of Ralink Technology and Chris Kao, chairman of Ralink Technology will continue to serve in the same position.
Shinjou Fang, chairman of TrendChip Technologies, said: “Ralink and TrendChip have worked closely over the past several years to win joint designs with common customers across the globe. Both Ralink and TrendChip share a similar vision of the Networked Digital Home, and both companies are executing on similar strategies to deliver industry-leading performance at disruptive price points.”
Chris Kao, chairman of Ralink Technology, said: “By combining Ralink and TrendChip into a single company, Ralink Technology Corporation will be positioned to drive the growth of high-performance yet cost-effective ‘triple play’ voice, video, and data services throughout the Networked Digital Home.”
Ralink is headquartered in Hsinchu, Taiwan, and operates an advanced development centre in Cupertino, California. Its 802.11n offerings are embedded in products across Wi-Fi market segments including personal computers, broadband gateways, digital televisions, Blu-Ray players, web cameras, and IPTV set-top-boxes.
