Smart Modular Technologies (Smart), a manufacturer of memory modules and solid-state storage products including SSDs, has expanded its lineup of DDR3 small modules.
The new products include unbuffered and registered error-correction code (ECC) mini-DIMMs in very-low-profile (VLP) and standard heights and unbuffered and registered ECC SO-DIMMs.
The company claims that the DDR3 ECC small modules are optimised for space savings, high density, lower power, and high performance, serving a variety of applications in the networking, telecom, storage, and industrial markets.
According to Smart, the expanded lineup of DDR3 modules include SO-UDIMM (unbuffered w/ ECC) with a density of 1GB-4GB; SO-RDIMM (registered) with density from 2GB-4GB, VLP Mini-UDIMM (unbuffered w/ ECC) with 1GB-4GB, Mini-UDIMM (unbuffered with ECC) with density from 1GB-4GB, VLP Mini-RDIMM(registered) with density from 1GB-4GB, and Mini-RDIMM (registered) with density ranging from 1GB-8GB.
Mike Rubino, vice president of engineering at Smart, said: “For small form-factor designs to exploit the benefits of memory technologies initially developed for computer servers and PCs, module manufacturers must apply a significant amount of engineering expertise to optimise and qualify these modules for operation in a wide range of alternative CPUs/platforms.
“Smart’s design teams have done just that, and I am very pleased with our broad offering of tailored, small form-factor DDR3 modules that have already been qualified by a number of OEMs across a variety of application-specific processors.”
The new DDR3 small modules volume production is expected to begin in the first quarter of 2010.
