Applied Materials has released its Applied Charger UBM PVD system, specifically designed for under-bump metallisation (UBM), redistribution layer and CMOS image sensor applications.
The company said that the new charger system will define a new standard in metal deposition productivity and reliability for chip packaging. In addition, its Isani wafer treatment technology allows the Charger UBM system to process ten times more wafers between servicing to enable uptime performance and the lowest available per-wafer cost.
The company further said that its PVD reactor technology can tailor the properties of each film layer for optimum device performance while the flexible architecture enables extendibility to emerging three-dimensional interconnect and packaging technologies.
Steve Ghanayem, vice president and general manager of Applied Materials’ metal deposition and front end products, said: “Packaging facilities need a fast, dependable metallisation workhorse to maximise wafer output and minimise the system redundancy burden imposed by slower, less reliable alternatives. By blending our proven PVD process technology with packaging-specific innovations, we’ve created a highly productive, cost-efficient solution that is already churning out wafers in high volume production at multiple customers around the world.”