Agilent is an industry leader in the development and manufacture of highly integrated chips used in high-volume desktop printer applications.
Amkor will provide Agilent with a broad range of semiconductor package technology, using both leadframe and laminate (ball grid array) package platforms. In addition Amkor will support Agilent with multi-site supply assurance and comply with a vendor-managed inventory program. Agilent has transferred assembly assets to Amkor, where they are being integrated throughout Amkor’s operational base, including the newest locations in China, Taiwan and Japan.
Our alliance with Agilent is part of Amkor’s ongoing effort to reshape the semiconductor manufacturing environment, said Gary Waterhouse, Amkor’s senior vice president of business development. This agreement provides Agilent with several key benefits, including a cost-effective manufacturing environment, increased operational flexibility, and improved supply chain management. Incorporating Amkor early in Agilent’s design process will allow us to concurrently develop packaging technology for new semiconductor products, thus enhancing overall time to market.
Amkor and Agilent have worked together for several years, said Tan Bian Ee, vice president and general manager of worldwide manufacturing for Agilent’s Semiconductor Products Group. This agreement broadens that relationship and allows us to control our inventory needs. Our affiliation now extends from design to warehousing.
