Semiconductor company AMD has introduced two new Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts.
The APUs low power consumption and small 361sq.mm package is suitable for compact, fanless embedded systems including digital signage, kiosks, mobile industrial devices and the new small form factors such as Qseven.
AMD said that the offerings feature low-power x86 ‘Bobcat’ CPU cores and a discreet class DirectX 11-capable GPU on a single die.
In addition, the new Embedded G-Series APUs provide enterprise-class features and performance with the reliability, cost- and power-efficiencies, the company claimed.
The new platform also consists an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE.
AMD embedded solutions director Buddy Broeker said many of their embedded customers deploy fanless systems even with their 15W TDP processors.
"Today we take the AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement," Broeker said.
"System designers can now unleash their creativity without being constrained by heat or size issues."
