This agreement links two companies that are the leaders in their respective markets. Alpha provides an expansive RF semiconductor technology and dominant position in the MMIC switch market. As Europe’s largest manufacturer of passive components, EPCOS boasts extensive expertise in SAW filters and, more importantly, in Low Temperature Co-fired Ceramics (LTCC), which has become a major integration medium for passive and active RF components.
Consistent with our strategy to provide highly integrated RF modules for the mobile phone market, we have partnered with EPCOS to develop technology that dramatically enhances module performance and manufacturability, said David Aldrich, Alpha’s president and CEO. This alliance provides an essential module building block that secures Alpha’s position as the world’s leading provider of RF front-end solutions.
Under the agreement, the companies will develop switch/filter modules that will include control logic circuitry, switching and transmit/receive filtering. Initially, the modules are being developed for dual-band and eventually tri-band GSM handsets. Plans call for the first modules to begin shipping by September 2001.
Combining switch and filter products into a single, easy-to-use LTCC package offers OEMs shorter design lead times and enhanced functionality, enabling them to reduce time-to-market for their newest handset models, Aldrich said. These devices expand our technology base and create new market opportunities for Alpha in Europe and other major wireless markets around the globe. Ultimately, we see a competitive advantage in our ability to produce modules that occupy a smaller footprint and provide longer battery life and better overall RF performance than competing technologies.
Today’s announcement represents another milestone in Alpha’s product roadmap initiative based on the Company’s proprietary Alpha Integration Platform(TM) (aiIP(TM)), a technique for the design, simulation, packaging and testing of RF modules that integrate multiple functions. In May, Alpha announced the introduction of the world’s first tri-band power amplifier module employing InGaP HBT process technology.