Semiconductor chip maker Intel and Huawei, an ICT applications provider, have partnered to advance the development of interoperability testing and deployment of LTE TDD applications.
The two companies will launch a joint lab set-up based in China for Interoperability Test and fast implementation of LTE TDD technology.
The new joint venture will utilise Huawei’s LTE TDD network infrastructure technologies and Intel’s mobile communication platforms to expedite the maturity and deployment of LTE TDD.
Intel will carry out end-to -end testing of its mobile platforms in a real life environment, by connecting directly to the Huawei’s infrastructure.
Intel China IAG vice-president & MCG head W.K Tan said under the engagement with Huawei both the companies will take advantage of the each other’s strengths and leading technologies.
"We are committed to working together with partners in China to build a healthy LTE TDD ecosystem within China and even beyond,"Tan said.
