Intel Corp has thrown its weight behind moves to standardize packaging for memory chips used in handheld and mobile devices. Intel, along with Hitachi Corp, has given its backing to an agreement to create a common single package for stacking Flash memory and static random access memory (SRAM) chips. Such packages are used in devices such as mobile phones, handheld computers and digital cameras, and will become more prevalent as mobile devices proliferate. Sharp Corp and Mitsubishi Electric Co first proposed a standard packing specification last September; Toshiba, Fujitsu, NEC and others have all announced support for the specification.