This order places Applied Materials as the primary equipment supplier for GSMC and establishes the basis for a long-term, key partnership to support continuing manufacturing requirements. System shipments are scheduled to commence in 2002.
Dr. Winston Wong, chief executive officer of GSMC, commented, Our choice of Applied Materials to spearhead our manufacturing capability is based on its comprehensive, total solutions approach to semiconductor production that includes the industry’s broadest portfolio of outstanding process technologies and technical support. We are confident Applied Materials can support our successful entry into today’s competitive semiconductor industry by providing proven products and operational efficiencies that will allow us to maximize productivity and accelerate the delivery of our chips to market.
GSMC’s order includes multiple dielectric and conductor Etch, CVD (chemical vapor deposition), CMP (chemical mechanical planarization), PVD (physical vapor deposition), RTP (rapid thermal processing), ion implant and inspection-metrology systems. GSMC has also purchased a customized Total Support Package(TM) (TSP) for its Applied Materials systems. The TSP program outsources equipment maintenance and spare parts management to Applied Materials’ expert service teams, enabling increased system productivity and lower overall operating costs.
We are very impressed with the progress of China’s chipmaking industry and the commitment from companies such as GSMC to further facilitate the development of the region’s growing semiconductor market, said James C. Morgan, chairman and chief executive officer of Applied Materials. Applied Materials has worked for many years to put the infrastructure in place to support chipmakers, and today’s grand opening of our new Shanghai facility expands our capabilities in China to help our customers quickly ramp up their manufacturing lines to speed products to market.
Our strategic relationship with GSMC is very gratifying and presents an exciting opportunity for Applied Materials to further participate in China’s rapidly developing semiconductor industry, said Dr. David N. K. Wang, executive vice president and member of office of the president of Applied Materials. The GSMC fab in Shanghai represents a new phase in China’s manufacturing infrastructure, and demonstrates that the country is set to become a major player in the global IC market.
