Located in Shanghai, the newly-built 34,000 square meter factory will take in wafers from SanDisk’s chipmaking plant in Japan and assemble them into system-on-a-chip – SiP – packages for use in mobile phones.
SanDisk said it expects the factory to produce 30% of its entire SiP output, and that the plant’s location in Shanghai puts it close to suppliers, and able to recruit staff from local universities.
