Development of a production prototype of their planned 64M-bit memory chip (CI No 1,827) is seen as putting IBM Corp and Siemens AG at least a little ahead of the field: the work is being done at IBM’s facilities in East Fishkill, New York, and Essex Junction, Vermont, with Siemens supplying half the research team and budget and a fair bit more work will be needed to refine it into a part that can be fabricated in volume – the part is currently to 0.4 micron design rules and the team wants to shrink that to 0.35 but will not be able to until camera, developed under the auspices of the Sematech consortium, is delivered in April.
